Waferpedia

Comparison ledger

108Tversus6DF

PR Hoffman 108T, Strasbaugh 6DF, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
108TPR Hoffman
6DFStrasbaugh
OEMPR HoffmanStrasbaugh
CategoryCMPCMP
Wafer sizeup to 12 in wafers22 in
Process node——
Introduced—2016
Production run—2016–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPR Hoffman 108TStrasbaugh 6DF
Specifications
carrier type listing108T 9B - S/F / Lapmaster LSP-9 / etc.[1]—
machine classfor double-sided planetary lapping & polishing machines[1]—
wafer sizes stated on insert-carrier page3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[1]—
maximum carrier diameter stated on insert-carrier pageup to 33 in diameter[1]—
maximum carrier diameter stated on lapping-carrier pageup to 48 in diameter[2]—
Capacity—22 in[3]
Manufacture year—2016[3]
Condition—Excellent[3]
Control panel—Fully loaded[3]
Model—6DF[3]
Manufactured—2016[3]
Included control—Fully loaded control panel[3]
Year of manufacture—2016[3]
Year stated—2016[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]excelltechnology.comexcelltechnology.com