Comparison ledger
Pfeiffer Alcatel Adixen AMS 200 DRIE, Tegal 1511e, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Alcatel Adixen AMS 200 DRIEPfeiffer | 1511eTegal |
|---|---|---|
| OEM | Pfeiffer | Tegal |
| Category | Etch | Etch |
| Wafer size | Single-Wafer Chamber for Deep Silicon Etch | three- to six-inch wafers |
| Process node | — | — |
| Introduced | — | 1984 |
| Production run | — | 1984– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Pfeiffer Alcatel Adixen AMS 200 DRIE | Tegal 1511e |
| Specifications | ||
| Power | 400 V, 50/60 Hz, 3-Phase[1] | — |
| Electrical Feed | 480 VAC to Tool[1] | — |
| Tool Supply | 208 V, 500 A, 3-Phase, 4-Wire[1] | — |
| Wafer size | Single-Wafer Chamber for Deep Silicon Etch[1] | — |
| Process Gases | Ar, O2, N2, C4F8, SF6 & He[1] | — |
| RF Power | 5 kW[1] | — |
| Platen Power | 3 kW[1] | — |
| Cooling | Standalone Chiller[1] | — |
| Cryogenic Cooling | No[1] | — |
| Turbo Pump | Removed / Not Included[1] | — |
| Roughing Pump | Removed / Not Included[1] | — |
| Trap | Removed[1] | — |
| Foreline | Removed[1] | — |
| Wafer Size | 8 inch[1] | — |
| Auto Load/Unload | Yes[1] | — |
| Robot | 1 Robot from cassette to chamber[1] | — |
| Chamber Type | Single-Wafer Chamber[1] | — |
| Process Type | Deep Silicon Etch (DRIE)[1] | — |
| Vacuum & Air Utilities | Yes[1] | — |
| Additional Spares | Yes[1] | — |
| Spare Trap | Available[1] | — |
| tool type | — | tri-electrode dual-frequency plasma etch system[2] |
| wafer size | — | three- to six-inch wafers[2] |
| first sold | — | 1984[2] |
| system characteristic | — | first vacuum-loadlocked dual-frequency tri-electrode etch system[2] |
| First vacuum-loadlocked dual-frequency tri-electrode etch system | — | Yes[2] |
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