MRSI
HVM3 alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Esec
DB 2100 HS
Packaging & Bonding
The Esec DB 2100 HS is a die bonder with source-stated accessories, power information, and vintage year entries in the provided records.
Finetech
Lambda
Packaging & Bonding
Finetech Lambda is a die bonder with sub-micron placement accuracy, supporting thermocompression and ultrasonic bonding.
ASM
LinDA
Packaging & Bonding
The ASM LinDA is a die bonder used in semiconductor packaging and bonding.
ASM
AD 838 L
Wafer Loader
Packaging & Bonding
The ASM AD 838 L is a die bonder for semiconductor packaging applications.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
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