Waferpedia

Comparison ledger

Momentum II 100versus1000P

MPM Momentum II 100, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMMPMYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilyMPM Momentum II 100YES 1000P
Specifications
ConfigurationAutomatic Stencil Positioning[1]Parallel plate[5]
Machine typeStencil printer[2]—
Automatic stencil positioning camera visionIncluded[2]—
Automatic stencil-to-board alignmentIncluded[2]—
Stencil cleanerUltraWipe stencil cleaner[2]—
Maximum board size609.6 mm x 508 mm (24" x 20")[3]—
Print speed0.635 mm/s - 304.8 mm/s[3]—
Accuracy and repeatabilityCpk ≥ 2.0[3]—
Wet print deposit±17 microns (±0.0007") at 6 sigma[3]—
Alignment repeatability±11 microns @ 6 sigma[3]—
Wet print accuracy20µm@6σ, Cpk ≥ 2[3]—
Line-length reduction200 mm shorter than the standard Momentum II stencil printer platform[3]—
Model—1000P[4]
System type—Plasma cleaning system[4]
Shelf configuration—Four 16 x 16 inch shelves[4]
Total capacity—1024 square inches[4]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[4]
Number of shelves—4[4]
Shelf size—16 x 16 inches[4]
Power—1000 W[5]
Operation modes—Active, RIE, Downstream[4]
Sample size range—From smallest semiconductor chip to large flat panels[4]

Plan your fab

Building a Wet Processing / Clean process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]efsmt.comefsmt.com
  4. [4]web.archive.orgweb.archive.org
  5. [5]semistarcorp.comsemistarcorp.com