Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 7700E Series, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 7700E SeriesWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 7700E Series |
| Cited variants | — |
|
| Specifications | ||
| Wafer Size | 6 inch[2] | — |
| Model line | — | 7700E Series[1] |
| Machine type | — | Manual operation ball-wedge bonder[1] |
| Bonding method | — | Thermosonic ball-wedge wire bonder[1] |
| Axis configuration | — | Manual X-Y-Z[1] |
| Application | — | Interconnect wire leads to semiconductor, hybrid, or microwave devices[1] |
| Wire type | — | Gold wire[1] |
| Wire diameter range | — | 0.0007 inches and larger range stated in manual excerpt[1] |
| Bond tool shank diameter | — | 1/16 inch[1] |
| Bond tool length | — | 0.625 inch or 0.750 inch for deeper access[1] |
| Wire spool mount | — | Standard 1/2 inch ball bearing spool mount[1] |
| Buffer count | — | Thirty different buffers[1] |
| Maximum bonds per wire | — | 21[1] |
| Wire tail default | — | 95 motor steps[1] |
| Heater | — | Radiant heater for the wedge bonding tool[1] |
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