Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 4KE Series, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 4KE SeriesWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 4KE Series |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Type | — | Semi-automatic wire bonders[2] |
| Axis control | — | Microprocessor controlled motor drives for both Y and Z-axes[2] |
| Bonding capability | — | Bonds a succession of parallel, single or multiple arched wires[2] |
| Loop and bond consistency | — | Maintains identical loop and bond shapes[2] |
| Access | — | Unlimited deep-reach access to bond targets on IC packages of any X-Y dimension[2] |
| Application fit | — | Ideal for bonding high power, high frequency devices where identical bond and loop shapes are critical[2] |
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