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1 WBS 1 Wafer SubstrateversusSH 100 NIV.A Horizontal Injection

Logitech 1 WBS 1 Wafer Substrate, Sumitomo SH 100 NIV.A Horizontal Injection, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
1 WBS 1 Wafer SubstrateLogitech
SH 100 NIV.A Horizontal InjectionSumitomo
OEMLogitechSumitomo
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech 1 WBS 1 Wafer SubstrateSumitomo SH 100 NIV.A Horizontal Injection
Specifications
Wafer Size6 inch[1]—
Configuration—Picker Machine, Auto-Gate Cutting, Conveyor, MTC & Mold[2]
Machine type—Horizontal injection molding machine[2]
Documented unit vintage—1995[2]
1 WBS 1 Wafer Substrate entrySH 100 NIV.A Horizontal Injection entryAsk about these tools →Share experience with this comparison →

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing