Comparison ledger
Laurell EDC-HL-23, Laurell H6-8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EDC-HL-23Laurell | H6-8Laurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Spin coater | Spin coater |
| Wafer size | 150mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 650-series | — |
| Family | Laurell EDC-HL-23 | Laurell H6-8 |
| Cited variants |
|
|
| Specifications | ||
| Process controller | 650-series process controller[1] | — |
| Wafer capacity | Up to 150 mm wafers[1] | Up to 200mm wafers[2] |
| Substrate capacity | Up to 5 in x 5 in (127 mm x 127 mm) substrates[1] | Up to 7" × 7" (178mm × 178mm) substrates[2] |
| Maximum rotation capability | 12,000 RPM with vacuum hold-down[1] | — |
| Recommended operating speed | 3,000 RPM with non-vacuum chucks[1] | — |
| Power | 95 to 240 VAC, 47/63 Hz, ~300 Watts[1] | 95 to 240VAC, 47/63HZ, ~300 Watts[2] |
| Nitrogen/CDA seal purge pressure | 60–70 PSIG (4–5 bar)[1] | — |
| Vacuum recommendation | 25–28 inches Hg with 4.5 SCFM at 0 inches Hg[1] | — |
| Maximum rotational speed | — | 12,000 RPM (based on a 100mm silicon wafer)[2] |
| Series | — | 650-series HL coater system[2] |
| N2 process/seal purge | — | 60–70 PSIG (4–5 bar) of Nitrogen/ CDA; gas consumption 3 cubic feet per hour (0.085 m3/hour)[2] |
| Vacuum | — | 25–28 inches (~635–711mm) Hg; flow volume 4.5 SCFM (0.127 cubic meters/minute) at 0 inches Hg[2] |
| Typical process use | — | Solvent, Base or Acid-based processing[3] |
| System type | — | Spin coater[3] |
| Standard chuck | — | Vacuum chuck[3] |
| Standard adapter | — | Fragment adapter[3] |
| Control software | — | Laurell Touch process control software; Spin 3000 PC software[3] |
| Vacuum requirement | — | 25 to 28 inches Hg; 4.5 SCFM at 0 inches Hg[3] |
| Nitrogen/CDA purge pressure | — | 60 to 70 PSIG[3] |
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