Comparison ledger
Laurell EDC-650-23B, Laurell WS-650-23B, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EDC-650-23BLaurell | WS-650-23BLaurell |
|---|---|---|
| OEM | Laurell | Laurell |
| Category | Resist Processing | Resist Processing |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Laurell EDC-650-23B | Laurell WS-650-23B |
| Cited variants | — | |
| Specifications | ||
| Model | EDC-650-23B[1] | WS-650-23B[1] |
| Type | EDC System[1] | spin coater[1] |
| Controller Series | 650 Series[1] | — |
| Max Substrate Size | Ø150mm (5" × 5")[1] | — |
| Max RPM | 12,000 rpm[1] | 12,000 rpm[1] |
| Mounting Options | Tabletop, In-Deck, On-Deck[1] | — |
| Controller | — | 650 Series[1] |
| Max substrate size | — | ø150mm (5" × 5")[1] |
| Mounting options | — | Tabletop, In-Deck, On-Deck[1] |
| Max rotational speed | — | 12,000 RPM (based on a ø100 mm silicon wafer)[2] |
| Power requirement | — | 95 to 240 VAC, 47/63 Hz, ~300 W[3] |
| Nitrogen purge pressure | — | 60–70 PSIG (4–5 bar)[3] |
| Vacuum requirement | — | 25–28 inches Hg (~635–711 mm Hg) at 4.5 SCFM[3] |
| Housing material | — | Solid co-polymer blend (standard); optional PTFE Hostaflon TFM-1600 / Teflon AF[2] |
| Controller type | — | 650-series microprocessor controller with optional PC/Spin 3000 software[2] |
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