Waferpedia

Comparison ledger

400-seriesversusEDC-HL-15

Laurell 400-series, Laurell EDC-HL-15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
400-seriesLaurell
EDC-HL-15Laurell
OEMLaurellLaurell
CategorySpin coaterSpin coater
Wafer size150mm300mm
Process node——
Introduced1995—
Production run1995–—
LifecycleDiscontinued—
Lifecycle milestones2011 End of life—
Control system——
Generation—650-series
FamilyLaurell 400-seriesLaurell EDC-HL-15
Cited variants
  • EDC-HL-15 B650-series[2]
  • EDC-HL-23B650-series[2]
  • EDC-HL-8B650-series[2]
Specifications
Process controller400-series process controller capable of storing and automatically running process recipes consisting of run time and acceleration rate, with manual operation also supported[1]—
Spin speed10,000 RPM (based on a 100 mm SEMI Std. wafer)[3]—
Maximum wafer sizeUp to 150 mm wafers[3]—
Substrate size4" x 4" (102 mm x 102 mm) substrates[3]—
Standard chuck1.75" (45 mm) diameter vacuum chuck[3]—
Standard adapter coverageOne fragment adapter standard covering 10 mm through 150 mm SEMI wafers[1]—
Housing materialSolid co-polymer blend exclusive to Laurell Technologies[1]—
Power95 to 240 VAC, 47/63 Hz, ~300 Watts[1]95 to 240 VAC, 47/63 Hz, ~300 Watts[2]
Vacuum suggestion25–28 inches Hg vacuum with 4.5 SCFM flow at 0 inches Hg suggested[1]—
Maximum substrate sizeØ150 mm wafers and 4" × 4" (102 mm × 102 mm) substrates[3]—
Maximum speed10,000 RPM (based on a Ø100 mm SEMI Std. wafer)[3]—
Vacuum chuck diameter1.75" (45 mm) diameter vacuum chuck[1]—
Fragment adapter coverage10 mm through 150 mm SEMI wafers[1]—
Power requirement95 to 240VAC, 47/63HZ, ~300 Watts[1]—
Model—EDC-HL-15 B[2]
Series—650-series EDC system[2]
Wafer/substrate capacity—Up to ø 300 mm wafers and 9" × 9" (229 mm × 229 mm) substrates[2]
Maximum speed capability—12,000 RPM with vacuum hold-down[2]
Recommended speed—3,000 RPM[2]
Recommended chuck type—Non-vacuum chucks[2]
Category—Spin coater[2]
Wafer capacity—Up to 300mm wafers[2]
Substrate capacity—9 in × 9 in (229mm × 229mm) substrates[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org