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Comparison ledger

12 LapperversusRR 700 L 150 Z 30

Lapmaster 12 Lapper, Rorze RR 700 L 150 Z 30, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
OEMLapmasterRorze
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Rorze RR 700 L 150 Z 30
Cited variants—
  • RR700L150-Z30-01[1]
Specifications
Outside plate diameter12 inches[2]—
Lapping Speed Range0 to 60 rpm[3]—
Wafer Size Compatibility4 inches or smaller[2]—
Input Voltage110 V[2]—
Frequency60 Hz[2]—
Phase1[2]—
Number of Rings3[2]—
Number of Weights3[2]—
Includes Slurry SystemYes[2]—
Includes TimerYes[2]—
Configuration—Single Arm, compatible with AMAT Mirra Mesa CMP[4]
Wafer size—6 inch[4]
Wafer size (alternate variant)—200mm[1]
Arm configuration—Single arm[4]
Compatible systems—AMAT Mirra Mesa CMP[4]
Application type—SMIF robot[1]
Wafer size (base model)—6 inch[4]
Robot type—Dry robot[5]
Manufacturer—Rorze[4]
Model—RR 700 L 150 Z 30[4]
Category—CMP[6]
Wafer handling size—200 mm[6]
Compatibility—AMAT Mirra Mesa CMP[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]tarasemi.comtarasemi.com
  2. [2]jmind.comjmind.com
  3. [3]etd.ohiolink.eduetd.ohiolink.edu
  4. [4]inventory listing
  5. [5]shop.entrepix.comshop.entrepix.com
  6. [6]waferpedia.comwaferpedia.com