Waferpedia

Comparison ledger

2300 Kiyo EXversus1512e

Lam Research 2300 Kiyo EX, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2300 Kiyo EXLam Research
1512eTegal
OEMLam ResearchTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research 2300Tegal 1512e
Specifications
ConfigurationPolysilicon[1]—
OEMLam Research[1]—
Model2300 Kiyo EX[1]—
DescriptionPolysilicon Etch[2]—
Equipment typeEtch/Ash/Clean - Plasma Processing Equipment[2]—
Currently configured for300 mm[2]—
Tool modelKIYOEX[2]—
System power rating208 AC 3-Phase[2]—
Loading configuration3 Load ports[2]—
ChambersChamber 1, Chamber 2, Chamber 3[2]—
Chamber descriptionsKIYOEX, KIYOEX, KIYOEX[2]—
Process TypePolysilicon Etch[2]—
Wafer Size300mm[2]—
Load Ports3[2]—
Chamber TypeKIYOEX[2]—
N2 Load Port VendorJUSTEM[2]—
Tool type—Industrial RIE plasma etcher system[3]
Stated configuration—With modules assembly for CI-4222[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]macquarie.commacquarie.com
  3. [3]semistarcorp.comsemistarcorp.com