Comparison ledger
Hybond 572 A 40 Thermosonic Wire & Ribbon, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | |
|---|---|---|
| OEM | Hybond | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hybond 572 A 40 Thermosonic Wire & Ribbon | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | Long reach[1] | — |
| Options | OP-06B, OP-08A-LED, OP-17, OP-31, WST-15CM, T91S, 9400[1] | — |
| Ultrasonic system | PLL self-tuning, 62.5 KHz (±2.5KHz) nominal[2] | — |
| Ultrasonic power range | 0-1 watt on Low setting (default), 0-2 watts on High setting[2] | — |
| Bond time range | 10 - 400 mSec[2] | — |
| Bond force range | 15 - 120 grams[2] | — |
| Temperature control range | Ambient to 250° C[2] | — |
| Bondable wire diameters | 0.5 to 2.0 mils (12.7 to 50.8 µm)[2] | — |
| Bondable ribbon dimensions | Up to 1 x 10 mils (25.4 x 254 µm)[2] | — |
| Bondable wire/ribbon materials | Gold, aluminum, copper, silver, platinum[2] | — |
| Bond head movement | Manual[2] | — |
| Bond actuation | Switch at fixed height, actuated by lever[2] | — |
| Z axis travel | 0.5 in (12.7 mm) / 60-100 mils (1.52-2.54 mm)[2] | — |
| X-Y table motion/travel | 4:1 manual manipulator standard / 0.9 x 0.9 in (23 x 23 mm) max[2] | — |
| Input power requirements | 110VAC 50/60Hz @ 10A max; 240VAC with OP-12[2] | — |
| Minimum bench space required | Width 25 in, Depth 30 in (63.5 x 76.2 cm)[2] | — |
| Unit weight | 70 lbs (31.8 kg)[3] | — |
| Shipping weight | 150 lbs (68.2 kg)[3] | — |
| Vacuum requirement | 20 inHg minimum[2] | — |
| Industry standards | CE certified[2] | — |
| Deep vertical access | 0.59 in (1.49 cm)[2] | — |
| Long horizontal reach | 6.5 in (16.5 cm)[2] | — |
| Work platform size (X-Y) | 10 x 12 in (25 x 30 cm)[3] | — |
| Type | Thermosonic wedge bonder[4] | — |
| Bonding capability | Wire and ribbon bonding[2] | — |
| Access type | Deep-access, long-reach[4] | — |
| Soft Touch technology | HYBOND Soft Touch bonding technology[2] | — |
| Wire feed | Motorized vertical wire feed[2] | — |
| Z-axis control | Independent Z-axis lever for bonding tool control[2] | — |
| Stitch capability | 1-1-2, 1-2-2, and 1-2-1[2] | — |
| Spool mounts | 0.5 inch and 2 inch spool mounts[2] | — |
| Work platform | 6 x 8.5 inch work platform[4] | — |
| Wire diameter range | 0.5 to 2.0 mils[2] | — |
| Ribbon dimension | Up to 1 x 10 mils[2] | — |
| Bondable materials | Gold, aluminum, copper, silver, platinum[2] | — |
| Z travel | 0.5 in[2] | — |
| Unit weight / shipping weight | 70 lbs / 150 lbs[2] | — |
| Wafer Size | — | 6 inch[5] |
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