Waferpedia

Comparison ledger

620versus620 Mask

EV Group 620, EV Group 620 Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
620EV Group
620 MaskEV Group
OEMEV GroupEV Group
CategoryLithographyLithography
Wafer size—3 Station Wafer Handler
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 620EV Group 620
Specifications
ConfigurationMercury Lamp Exposure System[1]50 / 60 Hz[3]
Voltage—200 V[3]
Phase—2 Phase[3]
Current Rating—10 A[3]
Interrupting Capability—50 kiloamps[3]
Overcurrent Protection—Provided at machine terminals[3]
Frequency—50/60 Hz[4]
Power consumption—1.55 kW[4]
Full load current rating—7.45 A[4]
Largest current rating—7.45 A[4]
Breaker size / AIC—10 A / 10 kA[4]
Compressed Air (CDA)—6 bar / 87 psi[4]
Nitrogen or CDA—6 bar / 87 psi[4]
Vacuum—< 850 mbar / 6460 torr[4]
Wafer Sizes—2, 3, 4, 5, 6, 12 inch[4]
Backside Alignment—Capable[5]
Infrared Alignment—Capable[5]
Chuck Size—5 inch to 6 inch[5]
OEM—EV Group[3]
Model—620 Mask[3]
Equipment type—Mask Aligner[3]
Category—Lithography[3]
Wafer size—4 inch[3]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing