Comparison ledger
EV Group 101, Nikon NSR 2005 i 9 C i-Line, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101EV Group | |
|---|---|---|
| OEM | EV Group | Nikon |
| Category | Lithography | Lithography |
| Wafer size | — | Standard PDP 11/93 Computer & Silicon Carbide Wafer Loader Type 1 Conversion on it |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 101 | Nikon NSR 2005 |
| Specifications | ||
| OEM | EV Group[1] | — |
| Model | 101[1] | NSR 2005 i 9 C[4] |
| Equipment name | EVG 101 Spray Coater[1] | — |
| NEMO ID | evgspraycoat[1] | — |
| Training required | EVG 101 Training[1] | — |
| Training duration | 1.50 hours[1] | — |
| Processing technique | Resist Spray Coat (manual)[1] | — |
| Cleanliness | "All"[1] | — |
| Location | SNF Paul G Allen L107 Cleanroom[1] | — |
| Wafer diameter (substrate size) | up to 300 mm[2] | — |
| Available modules | Spin coat / OmniSpray® / develop[2] | — |
| Wafer handling options | Bowed / warped / thin wafer handling, edge handling[2] | — |
| Dispense options | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] | — |
| Processing technique (at SNF) | Resist Spray Coat (manual)[3] | — |
| Cleanliness group (at SNF) | "All"[1] | — |
| Configuration | — | HDD & Software included[4] |
| Wafer size | — | Standard PDP 11/93 Computer & Silicon Carbide Wafer Loader Type 1 Conversion on it[4] |
| Reticle | — | 6", normal thickness[6] |
| Wafer | — | 8", OF direction 0*, Ring type wafer[6] |
| Lens type | — | 5iB3[6] |
| Magnification | — | 1/5[6] |
| Field size | — | 21.2 x 25.2mm[6] |
| Lamp power | — | 1750 KW[6] |
| Light source | — | Mercury lamp[6] |
| Reticle Alignment | — | i-line, CCD imagining[6] |
| Make | — | Nikon[4] |
| Reticle Size | — | 6 inch[4] |
| Numerical Aperture (NA) | — | 0.57 (selectable <0.57 >0.57)[8] |
| Exposure Light | — | i-line[8] |
| Sigma | — | 0.56 – 0.80[8] |
| Alignment Light | — | HeNe Laser, Halogen Lamp[8] |
| Alignment Method | — | CCD imaging + image processing[8] |
| Alignment Mode | — | LSA (HeNe laser) or FIA (halogen lamp)[8] |
| XY Stage Drive Method | — | Ball screw drive & two-axis interferometer[8] |
| XY Stage Stroke X | — | −115 mm to +150 mm[8] |
| XY Stage Stroke Y | — | −160 mm to +115 mm[8] |
| Auto Focus Method | — | Halogen lamp + AF line sensor[8] |
| Wafer Leveling | — | Two-axis ball screw drive[8] |
| Chamber Set Temperature | — | 23 °C[8] |
| Camera Type | — | CCD[8] |
| Power Supply | — | 208 V, 3 Phase[7] |
| CE Mark Certified | — | Yes[7] |
| Handler Type | — | Prealign II[7] |
| Power | — | 208 V, 3 Phase[7] |
| Manuals Included | — | Partial[7] |
| # of Cassette / FOUP Loaders | — | Cassette Stage[7] |
| Robot Type | — | OEM[7] |
| End Effecter Type | — | OEM[7] |
| Handler Options | — | SiC Substrate[7] |
| System SW (OS) Version | — | Nikon Nest[7] |
| Supporting Equipment | — | STD OEM Items[7] |
| CDA | — | N2[7] |
| DIW | — | Chilled Water[7] |
| PC Model | — | Present (original PC type)[8] |
| Hard Disk | — | Original[8] |
| NEST Upgrade | — | Version: NEST-2[8] |
| Wafer Size (6 inch) | — | 6 inch[7] |
| Wafer Size (8 inch) | — | 8 inch[6] |
| Numerical Aperture | — | 0.57 (range <0.57 >0.57 selectable)[8] |
| Sigma Range | — | 0.56 – 0.80[8] |
| Wafer Alignment Methods | — | LSA (HeNe laser), FIA (halogen lamp)[8] |
| Chamber Temperature Set | — | 23 °C[8] |
| Camera / Vision | — | CCD Type[8] |
| Computer (some units) | — | Standard PDP 11/93[4] |
| Wafer Loader (some units) | — | Silicon Carbide Wafer Loader Type 1 Conversion[4] |
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