Comparison ledger
Esec Datacon 2200 evo, Esec Datacon 8800 CHAMEO advanced, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Datacon 2200 evoEsec | |
|---|---|---|
| OEM | Esec | Esec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 4" | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | 3rd generation | — |
| Family | Esec Datacon 2200 evo | Esec Datacon 8800 CHAMEO advanced |
| Cited variants | — | |
| Specifications | ||
| Machine type | Die Bonder[1] | — |
| Bonding method | Epoxy[1] | Flip Chip Bonder[2] |
| Generation | 3rd generation[1] | — |
| Platform description | most flexible 300 mm high speed platform[1] | — |
| Wafer size | 4" to 12" (on 8" or 12" wafer frames)[1] | 4" to 12" (on 8" or 12" wafer frames)[1] |
| Bonding accuracy | 20 µm @ 3σ (15 µm option)[1] | — |
| Cycle time | 120 ms with Liquid Cooling option[1] | — |
| Die size | 0.25 mm (with Small Die Kit) to 20 mm[1] | — |
| Leadframe size | Length: 90 to 300 mm; Width: 23 to 100 mm[1] | — |
| Machine dimensions | 1785 x 1448 x 1400 mm (W x D x H)[1] | — |
| Product family | — | Hybrid Bonding[1] |
| X/Y placement accuracy local | — | ± 3 µm at 3 sigma[3] |
| X/Y placement accuracy global | — | ± 5 µm at 3 sigma[3] |
| Bond force | — | 2 - 50 N[3] |
| Die size face down | — | 0.3 - 30 mm[3] |
| Die size face up | — | 2.5 - 25 mm[3] |
| Die thickness | — | 50 µm - 3 mm[3] |
| Strip, boats, panels | — | Up to 340 mm[3] |
| Substrate wafer | — | 12"[3] |
| Fluxer | — | Option, various cavity plates available[3] |
| Multi Chip | — | Included[3] |
| UPH | — | Up to 7,000[3] |
| Vision system | — | 6 x 6 mm FoV for substrate and upwards camera; 12 x 12 mm FoV for wafer camera[3] |
| Field of view | — | 12 x 12 mm[2] |
| Overall dimensions | — | 1600 x 1200 x 1880 mm[2] |
| Wafer flip chip placement speed | — | 6000 UPH[2] |
| Wafer flip chip without dipping placement speed | — | Up to 9000 UPH[2] |
| Application | — | Chip attach for WL-FOP processes[3] |
| Supported package designs | — | Face-down (flip mode) and face-up (non flip mode)[3] |
| FO-WLP carrier | — | 300 mm / 340 mm[3] |
| Throughput | — | Up to 7,000 UPH[3] |
| Clean room class | — | ISO 5 (option)[3] |
| Footprint | — | 1,600 mm x 1,200 mm x 1,880 mm (W x D x H)[3] |
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