Waferpedia

Comparison ledger

1034versusOpus 3 SLT

Electroglas 1034, Semics Opus 3 SLT, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1034Electroglas
OEMElectroglasSemics
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyElectroglas 1034Semics Opus 3 SLT
Specifications
Type—Automatic[1]
Accuracy—1.5 µm[1]
Chuck size—175 x 200 mm[1]
Operating temperature—-40 to 200 °C[1]
Probing force—230 kgf[1]
Overall dimensions—1485 x 1720 x 960 mm[1]
Wafer size—8 inches, 12 inches[1]
Test temperature range—-55 °C to 200 °C[2]
Test temperature accuracy—±1 °C[2]
Chuck load capacity—200 kg[2]
Wafer Sizes Supported—8 inches, 12 inches[2]
Test Temperature Range (Alternative)—-40 °C to 200 °C[1]
System Overall Accuracy—±1.5 µm[2]
System Overall Accuracy (Alternative)—1.5 µm[1]
Chuck Flatness—within 15 µm[2]
Die Size Range—0.2 mm to 100 mm[2]
Acceptable Wafer Bow—2 mm for 8-inch and 12-inch wafers[2]
MTBF—> 180 hours[2]
OCR Image Recognition and Auto Needle Alignment—Yes (upward-looking camera, fully automatic)[2]
GPIB Communication—Yes[2]
Mapping Format Compatibility—TSK, TEL, OPUS[2]
Cleaning Modes—CLEAN PAD (100 mm x 200 mm), CLEAN WAFER (8 & 12 inch)[2]
Remote Control—TeamViewer, VNC[2]
Manufacturer—Semics Inc.[2]
Model—Opus 3 SLT[3]
Operating Temperature—-40 to 200 Degree C[1]
Equipment Name—高低温全自动探针台-Opus 3 SLT[2]
Instrument Number—22007413[2]
Origin—Korea[2]
Temperature Range—-55℃~200℃[2]
Temperature Accuracy—±1℃[2]
System Accuracy—±1.5 um[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]semiconductor.directorysemiconductor.directory
  2. [2]antpedia.comantpedia.com
  3. [3]Equipment inventory listing