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Comparison ledger

DFS 8960 Surface Planarizationversus15 Lapper

Disco DFS 8960 Surface Planarization, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
OEMDiscoLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2014 Vintage—
Control system——
Generation——
FamilyDisco DFS 8960 Surface PlanarizationLapmaster 15
Specifications
ConfigurationFully Automatic[1]Equipped with:[3]
Phase3 Phase[1]—
ModelDFS 8960 Surface Planarization[2]—
ManufacturerDisco[2]—
CategoryCMP[1]—
Wafer sizes8-inch, 12-inch[2]—
TypeFully automatic surface planarization system[1]—
Power200-230 V[1]—
Frequency50/60 Hz[1]—
Vacuum / pumpingTwo duct units for exhausting the process chambers[1]—
Included itemsSedimentation Tank (collection container); Disco DTU 1531 Chiller unit[2]—
Vintage2014[2]—
Number Of Conditioning Rings—Up to 3[3]
Ring ID—Up to 5.5″[3]
Plate Diameter – Outside—15″[3]
Plate Diameter – Inside—3 1/2″[3]
Standard RPM—60[3]
Drive Motor—1/2 HP[3]
Electrics—110V / 1Ph / 60Hz[3]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[3]
Equipped with: 15″ Cast Iron Plate—Included[3]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[3]
Equipped with: (3) Conditioning Rings—Included[3]
Equipped with: (3) Hold Downs—Included[3]
Equipped with: 30 Minute Timer—Included[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing