Comparison ledger
Disco DFS 8960 Surface Planarization, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 LapperLapmaster | |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2014 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFS 8960 Surface Planarization | — |
| Specifications | ||
| Configuration | Fully Automatic[1] | — |
| Phase | 3 Phase[1] | 1[3] |
| Model | DFS 8960 Surface Planarization[2] | — |
| Manufacturer | Disco[2] | — |
| Category | CMP[1] | — |
| Wafer sizes | 8-inch, 12-inch[2] | — |
| Type | Fully automatic surface planarization system[1] | — |
| Power | 200-230 V[1] | — |
| Frequency | 50/60 Hz[1] | 60 Hz[3] |
| Vacuum / pumping | Two duct units for exhausting the process chambers[1] | — |
| Included items | Sedimentation Tank (collection container); Disco DTU 1531 Chiller unit[2] | — |
| Vintage | 2014[2] | — |
| Outside plate diameter | — | 12 inches[3] |
| Lapping Speed Range | — | 0 to 60 rpm[4] |
| Wafer Size Compatibility | — | 4 inches or smaller[3] |
| Input Voltage | — | 110 V[3] |
| Number of Rings | — | 3[3] |
| Number of Weights | — | 3[3] |
| Includes Slurry System | — | Yes[3] |
| Includes Timer | — | Yes[3] |