Comparison ledger
Disco DFG 8760 DFM 2700 In-Line Wafer Grinder Lapper, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 15 LapperLapmaster | |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFG | Lapmaster 15 |
| Specifications | ||
| DFG 8760 | 3 Axis Dry Polishing Type 2[1] | — |
| Configuration | Z1, Z2 Grinder[1] | Equipped with:[3] |
| Make | Disco[2] | — |
| Model | DFG 8760 / DFM 2700[2] | — |
| Equipment type | In-Line Wafer Grinder / Lapper / Polisher[2] | — |
| Wafer sizes | 12 inch[1] | — |
| Polishing type | 3 Axis Dry Polishing Type[1] | — |
| Axis / station configuration | Z1, Z2 Grinder - Z3 Polisher[1] | — |
| Includes | Z2 NCG; Auto Label Printer; Dicing Tape Pre-Cut Unit; HDD & Software[1] | — |
| Vintage | 2006[1] | — |
| Number Of Conditioning Rings | — | Up to 3[3] |
| Ring ID | — | Up to 5.5″[3] |
| Plate Diameter – Outside | — | 15″[3] |
| Plate Diameter – Inside | — | 3 1/2″[3] |
| Standard RPM | — | 60[3] |
| Drive Motor | — | 1/2 HP[3] |
| Electrics | — | 110V / 1Ph / 60Hz[3] |
| Dimensions – Approximate | — | 26″(L-R) x 21″(F-B) x 22″(H)[3] |
| Equipped with: 15″ Cast Iron Plate | — | Included[3] |
| Equipped with: (3) Yoke/Roller Bearing Assemblies | — | Included[3] |
| Equipped with: (3) Conditioning Rings | — | Included[3] |
| Equipped with: (3) Hold Downs | — | Included[3] |
| Equipped with: 30 Minute Timer | — | Included[3] |