Disco
DFG 8560 alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
Meyer Burger
DS 266
Dicing & Grinding
The Meyer Burger DS 266 is a wire saw used for wafer dicing, available with electrical specifications of 400V, 120A, and 50 Hz.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
Blanchard
20 36 Surface
Dicing & Grinding
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
Blanchard
22 AD 42
Dicing & Grinding
Disco
321
Dicing & Grinding
Disco 321 is a wafer dicing saw designed for dicing semiconductor wafers.
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