Comparison ledger
Disco 3220, Disco DFL 7160 Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DFL 7160 |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Configuration | — | Non-operational[3] |
| Equipment type | — | Fully automatic laser saw[4] |
| Max. workpiece size | — | Φ300 mm[4] |
| Processing method | — | Ablation[4] |
| Laser wavelength | — | 355 nm[5] |
| Laser maximum power | — | 18 W[5] |
| X-axis processing range | — | 310 mm[4] |
| Y-axis processing range | — | 310 mm[4] |
| X-axis moving speed | — | 0.1–600 mm/s[4] |
| X-axis index step | — | 0.0001 mm[4] |
| Positioning accuracy | — | 0.003/310 mm (single error), 0.002/5 mm[4] |
| Z-axis moving resolution | — | 0.00005 mm[4] |
| Repeatability accuracy | — | 0.002 mm[4] |
| θ-axis max. rotating angle | — | 380 deg[4] |
| Equipment dimensions | — | 1,200 × 1,550 × 1,800 mm[4] |
| Equipment weight | — | Approx. 1,750 kg[4] |
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