Waferpedia

Comparison ledger

3220versusDAD 341 Automatic Dicing

Disco 3220, Disco DAD 341 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Vintage year
Control system——
Generation——
FamilyDisco 3220Disco DAD
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Spindle Max Revolution—60..000 RPM[3]
Power—AC 200 V[3]
Phase—3 Phase[3]
Configuration—250 Nl/min.[3]
Power AC—200 V[3]
Power Rating—3.0 KVA[3]
AIR Pressure—5 KGF/CM2 (0.5 MPa)[3]
AIR Flow—250 Nl/min[3]
N2 Pressure—5 Lgf/cm2 (0.5 MPa)[3]
Cutting Water Pressure—3 KGF/CM2 (0.3 MPa)[3]
Cutting Water Flow—4.0 L/min[3]
Cooling Water Pressure—2 kgs/cm2 (0.2 MPa)[3]
Cooling Water Flow—1.5 L/min[3]
Vintage—1998[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]inventory listing