Comparison ledger
Disco 321, Meyer Burger DW 288 S 4 Diamond, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | DW 288 S 4 DiamondMeyer Burger |
|---|---|---|
| OEM | Disco | Meyer Burger |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Meyer Burger DW 288 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | DW 288 S 4[4] |
| Equipment type | Wafer Dicing Saw[1] | — |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Configuration | — | Wire Management System WM2[4] |
| Operating hours of Mc | — | 18,534 hours[4] |
| Operating hours of automatic Mc | — | 453 hours[4] |
| Operating hours of main drive | — | 534 hours[4] |
| 13112403/2 | — | Way Solenoid Valve DN4 reference 10040439 (1)[4] |
| 1310366 | — | Cutting Fluid additive ADDITIVEA33 ref BLASER 29106020001 (1)[4] |
| 1310362 | — | Beam DMT710 420x50x16mm 100mm radius ref 10266500 (95)[4] |
| 1310361 | — | Beam DMT710 420x50x16mm 75mm radius ref 10266493 (175)[4] |
| 1310363 | — | Beam DMT710 carre 156 420x156x16mm ref 10266501 (95)[4] |
| 1310364 | — | Fil diamante 12 PLAU, 60KM, MB50 ref 12PLAU0F31560A (6)[4] |
| Manufacturer | — | Meyer Burger[4] |
| Category | — | Dicing & Grinding[5] |
| Machine type | — | Multi Wire Saw[6] |
| Application | — | Smart slicing technology for sapphire, and other hard and brittle materials[6] |
| Process | — | Slicing semiconductor silicon and sapphire into wafer[6] |
| Work piece dimensions | — | Max. Ø 8″ × 420 mm or ≤ 210 × 420 mm[7] |
| Web length | — | 420 mm[7] |
| Wire speed | — | 25 m/s (1500 m/min)[7] |
| Wire acceleration | — | 8 m/s² (< 4 s)[7] |
| Min. wire diameter | — | 100 μm[7] |
| Max. wire tension | — | 45 N[7] |
| Rocking principle | — | Rocking of work piece[7] |
| Rocking angle | — | ± 12°[7] |
| Wire guide roller axis distance | — | 540 mm[7] |
| Cutting fluid tank | — | 240 l[7] |
| Machine dimensions | — | 3620 × 1780 × 3010 mm[7] |
| Machine weight | — | 10500 kg[7] |
| Power & electrical | — | Standard Europe power management (400V, 230V Schuko plugs)[5] |
| US electrical conversion | — | UL conversion and voltage conversion (480V, 110V plugs)[5] |
| Wire management system | — | WM2[4] |
| Cutting fluid media module | — | Saphir cutting fluid media module with long filter[4] |
| Cutting fluid manifold | — | Without regulation valves, 1 mechanical flow meter, and flow bars[4] |
| Tank drain | — | With hand valve[4] |
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