Waferpedia

Comparison ledger

03 iX AutomaticversusYS 12 F

Dek 03 iX Automatic, Yamaha YS 12 F, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
YS 12 FYamaha
OEMDekYamaha
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDek 03 iX AutomaticYamaha YS 12 F
Specifications
Vintage2020[1]—
Substrate size (min)—L50 × W50 mm[2]
Substrate size (max)—L510 × W460 mm[2]
Mounting accuracy—±0.05 mm / CHIP[2]
Placement rate—20,000 CPH (company conditions)[2]
Component size range—0402 to 45 × 100 mm (including ball electrode components); components up to 15 mm height[2]
Component supply method—Tape and tray supply[2]
Tape component capacity—106 types (8 mm tape conversion)[2]
Tray component capacity—15 types (JEDEC tray conversion)[2]
Power supply—Three-phase AC 200/208/220/240/380/400/416 V ±10%[2]
Air supply requirement—Above 0.45 MPa, clean and dry[2]
Dimensions (with ATS15)—L1,254 × W1,755 × H1,475 mm[2]
Weight (with ATS15)—Approx. 1,370 kg[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]cnsmtline.comcnsmtline.com