Comparison ledger
CEE 300 Bake Plate, Despatch AST-1100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AST-1100Despatch | |
|---|---|---|
| OEM | CEE | Despatch |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 300 Bake Plate | Despatch AST-1100 |
| Cited variants | — | |
| Specifications | ||
| Wafer size | up to 300mm wafer[2] | Designed for 300 mm silicon wafers; also suitable for 200 mm wafers[4] |
| Software | Internal OS[2] | — |
| Voltage | 208V[2] | — |
| Max Substrate Size | 300mm round or 12" x 12" square[1] | — |
| Min Substrate Size | 4 inch round[1] | — |
| Max Temperature | 300°C (400°C optional)[1] | — |
| Temperature Resolution | 0.1°C[1] | — |
| Temperature Uniformity | ±0.3% across working area[1] | — |
| Smart Pin Height Range | 0-19 mm[1] | — |
| Weight (machine only) | 146 lb (66.2 kg)[3] | — |
| Dimensions | 18" H x 18.75" W x 26.25" D[3] | Approximately 262 cm wide and 224 cm long[4] |
| Power | 3100-4100 watts[3] | — |
| Exhaust Port | 2" (50.8mm) OD[3] | — |
| Tool type | — | Automated photowhite bake tool[4] |
| Tool capacity | — | 50 wafers with standard two-chamber configuration[4] |
| Temperature uniformity | — | +/-1.0 °C between wafers and across all 25 wafers in the chamber at dunk temperature[4] |
| Maximum temperature | — | 175 °C[4] |
| Atmosphere | — | Inert atmosphere[4] |
| Cooling | — | Active cooling for rapid cool down[4] |
| Filtration | — | HEPA filter[4] |
| Automation features | — | Supports two front-opening unified pod (FOUP) load stations, a class 1 cleanroom-compatible robot, and an optically based class 1 laser cassette imaging sensor[4] |
| Compliance | — | Meets SEMI S2/S8 and SEMATECH appendices A, B, and C[4] |
| Communication standards | — | Meets 300 mm SEMI communications standards[4] |
| Options | — | FOUP ID reader, 2-level monitoring, wafer ID reader, uninterruptible power supply (UPS)[4] |
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