Comparison ledger
CEE 100, KLA OP 7341 XP Film Thickness Measurement, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100CEE | |
|---|---|---|
| OEM | CEE | KLA |
| Category | Lithography | Lithography |
| Wafer size | 6" | 25 wafer load ports (Asyst) with robot transfer (2 paddies) |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 100 | KLA OP |
| Cited variants |
| — |
| Specifications | ||
| Tool type | Spray Developer[1] | — |
| Accepts wafer size | up to 6" wafers[2] | — |
| Programmable programs | 10 programs[2] | — |
| Steps per program | up to 10 steps[2] | — |
| Programmable step parameters | Acceleration, Speed, Time[2] | — |
| Associated document | CEE Model 100CB Spinner.doc[2] | — |
| Wafer size | Up to 6 inches[2] | 25 wafer load ports (Asyst) with robot transfer (2 paddies)[3] |
| Programs | 10 programs each with up to 10 steps[2] | — |
| Control parameters | Acceleration, Speed, Time[2] | — |
| Configuration | — | CD (1D & 2D features) & film stack measurement[3] |
| Software | — | UNT 6.0[3] |
| OEM | — | KLA / Therma-wave[3] |
| Model | — | OP 7341 XP[3] |
| Measurement functions | — | CD (1D & 2D features) & film stack measurement[3] |
| Alignment | — | Prealigner & full alignment using Vision Processing[3] |
| Computing | — | External Server SuperGrendel for fast computation (168 cores)[3] |
| Load ports | — | 25 wafer load ports (Asyst) with robot transfer (2 paddies)[3] |
| Environment | — | Integrated Mini-Environment[3] |
| Measurement chamber | — | Separated optical table design[3] |
| Motion isolation | — | Pneumatic floating system ensuring no vibration for both stage and optics tables[3] |
| User interfaces | — | Two user interface (Front & Read)[3] |
| Communication | — | SECS / GEM full capability[3] |
| Auto-focus | — | Included[3] |
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