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101-149-053 Gold Boosterversus572 A 40 Thermosonic Wire & Ribbon

Branson 101-149-053 Gold Booster, Hybond 572 A 40 Thermosonic Wire & Ribbon, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMBransonHybond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterHybond 572 A 40 Thermosonic Wire & Ribbon
Specifications
Configuration1:1.5[1]Long reach[4]
ManufacturerBranson[2]—
Model101-149-053[2]—
TypeGold Booster[2]Thermosonic wedge bonder[7]
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Options—OP-06B, OP-08A-LED, OP-17, OP-31, WST-15CM, T91S, 9400[4]
Ultrasonic system—PLL self-tuning, 62.5 KHz (±2.5KHz) nominal[5]
Ultrasonic power range—0-1 watt on Low setting (default), 0-2 watts on High setting[5]
Bond time range—10 - 400 mSec[5]
Bond force range—15 - 120 grams[5]
Temperature control range—Ambient to 250° C[5]
Bondable wire diameters—0.5 to 2.0 mils (12.7 to 50.8 µm)[5]
Bondable ribbon dimensions—Up to 1 x 10 mils (25.4 x 254 µm)[5]
Bondable wire/ribbon materials—Gold, aluminum, copper, silver, platinum[5]
Bond head movement—Manual[5]
Bond actuation—Switch at fixed height, actuated by lever[5]
Z axis travel—0.5 in (12.7 mm) / 60-100 mils (1.52-2.54 mm)[5]
X-Y table motion/travel—4:1 manual manipulator standard / 0.9 x 0.9 in (23 x 23 mm) max[5]
Input power requirements—110VAC 50/60Hz @ 10A max; 240VAC with OP-12[5]
Minimum bench space required—Width 25 in, Depth 30 in (63.5 x 76.2 cm)[5]
Unit weight—70 lbs (31.8 kg)[6]
Shipping weight—150 lbs (68.2 kg)[6]
Vacuum requirement—20 inHg minimum[5]
Industry standards—CE certified[5]
Deep vertical access—0.59 in (1.49 cm)[5]
Long horizontal reach—6.5 in (16.5 cm)[5]
Work platform size (X-Y)—10 x 12 in (25 x 30 cm)[6]
Bonding capability—Wire and ribbon bonding[5]
Access type—Deep-access, long-reach[7]
Soft Touch technology—HYBOND Soft Touch bonding technology[5]
Wire feed—Motorized vertical wire feed[5]
Z-axis control—Independent Z-axis lever for bonding tool control[5]
Stitch capability—1-1-2, 1-2-2, and 1-2-1[5]
Spool mounts—0.5 inch and 2 inch spool mounts[5]
Work platform—6 x 8.5 inch work platform[7]
Wire diameter range—0.5 to 2.0 mils[5]
Ribbon dimension—Up to 1 x 10 mils[5]
Bondable materials—Gold, aluminum, copper, silver, platinum[5]
Z travel—0.5 in[5]
Unit weight / shipping weight—70 lbs / 150 lbs[5]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]inventory listing
  5. [5]hybond.comhybond.com
  6. [6]hybond.comhybond.com
  7. [7]waferpedia.comwaferpedia.com