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Comparison ledger

101-149-053 Gold BoosterversusBJ 820 Wire Bonder Transport

Branson 101-149-053 Gold Booster, Hesse & Knipps BJ 820 Wire Bonder Transport, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMBransonHesse & Knipps
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterHesse & Knipps BJ 820 Wire Bonder Transport
Specifications
Configuration1:1.5[1]—
ManufacturerBranson[2]—
Model101-149-053[2]BJ 820[4]
TypeGold Booster[2]High Speed Fully Automatic Wedge Bonder[5]
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Make—Hesse & Knipps (H&K)[4]
Description—Wire Bonder Transport System[4]
Vintage—2013[4]
Work area—305 mm x 410 mm[5]
Wire materials—Aluminium or gold wire or ribbon[5]
Equipment type—Wire Bonder Transport System[4]
Machine description—High Speed Fully Automatic Wedge Bonder[5]
Working area—305 mm x 410 mm (12.3" x 16.14")[5]
Speed—Up to 7 wires per second[5]
Wire diameter range—17.5 μm – 60 μm; optional 12.5 μm – 85 μm[5]
Ribbon materials—Al, Au[5]
Ribbon range—6 μm x 35 μm – 25 μm x 250 μm[5]
Footprint—722 mm x 1250 mm[5]
Integrated controls—Integrated PLC controller; standard SMEMA input and output ports; Profibus support[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]Equipment inventory listing
  5. [5]keers-technologies.comkeers-technologies.com