Waferpedia

Comparison ledger

0 500versus200 Bake Plate

Blue M 0 500, CEE 200 Bake Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0 500Blue M
OEMBlue MCEE
CategoryThermal / DiffusionThermal / Diffusion
Wafer size—200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlue M 0 500CEE 200
Specifications
ManufacturerBlue M[1]—
Model0 500[1]—
Asset number139866[1]—
Last confirm dateSeptember 10, 2025[1]—
Equipment typeOven[1]—
Wafer size—up to 200mm wafer[2]
Software—Internal OS[2]
Voltage—208V[2]
Wafer Size—up to 200 mm[3]
Maximum Temperature—300 °C[3]
Bake Methods—Hard contact, Proximity (lift 25-100 μm using N2)[3]
Exhaust Cover—Yes (removal of fume)[3]
Smart Pins for Temperature Control—Yes[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]aggiefab.tamu.eduaggiefab.tamu.edu