Comparison ledger
Besi 2009 SSI E, Branson 101-149-053 Gold Booster, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2009 SSI EBesi | 101-149-053 Gold BoosterBranson |
|---|---|---|
| OEM | Besi | Branson |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Single Wafer Loader | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2009 SSI E | Branson 101-149-053 Gold Booster |
| Cited variants |
| — |
| Specifications | ||
| Configuration | SoftSolder Wire Dispense (OMP1,OMP780 and OMP1230)[1] | 1:1.5[4] |
| Wafer size | Single Wafer Loader[1] | — |
| SoftSolder Wire Dispense | OMP1, OMP780, OMP1230[1] | — |
| Wafer Handling | Single Wafer Loader[1] | — |
| Handling | Magazine to Magazine[1] | — |
| Vintage | 2014[1] | — |
| Type | Die Bonder[1] | Gold Booster[5] |
| Process capabilities | SoftSolder Wire Dispense (OMP1, OMP780, OMP1230)[1] | — |
| Material handling | Magazine to Magazine[3] | — |
| Make | Besi / Datacon[1] | — |
| Model | 2009 SSI E[1] | 101-149-053[5] |
| SoftSolder Wire Dispense Options | OMP1, OMP780, OMP1230[1] | — |
| Wafer Loader | Single Wafer Loader[1] | — |
| Equipment type | Die bonder[1] | — |
| Wire dispense | SoftSolder wire dispense[1] | — |
| Compatible OMPs | OMP1, OMP780, and OMP1230[1] | — |
| Loader type | Single Wafer Loader[1] | — |
| Handling mode | Magazine to Magazine[1] | — |
| Manufacturer | — | Branson[5] |
| Operating frequency | — | 20 kHz[6] |
| Gain | — | 1:1.5[5] |
| Mounting thread | — | 1/2-20[6] |
| Length | — | 5.4 in[6] |
| Gain ratio | — | 1:1.5[5] |
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