Comparison ledger
Axcelis 200 ACU, Tokyo Electron TSP 305 SCCM SE+ Oxide, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 ACUAxcelis | TSP 305 SCCM SE+ OxideTokyo Electron |
|---|---|---|
| OEM | Axcelis | Tokyo Electron |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | Tokyo Electron TSP 305 SCCM SE+ Oxide |
| Specifications | ||
| Configuration | Parts Machine[1] | — |
| Manufacturer | Axcelis[1] | — |
| Model | 200 ACU[1] | — |
| Tool type | Asher[1] | — |
| Wafer size | 200mm[3] | — |
| Serial number | AU6A356AH[3] | — |
| Computer system | M 200 PC, M 200[4] | — |
| Part number | SC 4572 A[4] | — |
| Volts | 208[4] | — |
| Amps | 30[4] | — |
| Equipment type | Asher[1] | — |
| Wafer configuration | 8 inch[2] | — |
| Vintage | — | 2006, 2007, 2008[5] |
| Wafer Size | — | 12"[6] |
| Carrier | — | FOUP (Comply with SEMI E47.1, 25 wafers)[6] |
| Interface | — | 5 Carrier stage (Continuous flow operation) with Semi compliant MENV and FIMS assemblies[6] |
| Process Chambers | — | 4 chambers, SCCM Oxide with Y2O3 coating[6] |
| End Point Detector | — | SE2000ii[6] |
| ESC Type | — | Ceramics ESC with STD Vpp[6] |
| Focus Ring | — | 3.4mm[6] |
| TMP | — | TMP-3403LMC-T4(VG300) (SHIMADZU)[6] |
| Dry Pump | — | ESR80WN, KEG approved[6] |
| APC | — | Pendulum Motion Dia., 320mm(VAT), R.T.~90deg[6] |
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