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Comparison ledger

200 ACUversusTelius 304 Polysilicon

Axcelis 200 ACU, Tokyo Electron Telius 304 Polysilicon, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tokyo Electron Telius 304 Polysilicon
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]—
Model200 ACU[1]Telius 304[5]
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Make—Tel (Tokyo Electron)[5]
Wafer Sizes—12 inch[6]
Category—Etch[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]waferpedia.comwaferpedia.com
  6. [6]Equipment inventory listing