Waferpedia

Comparison ledger

200 ACUversusSEZ SP 323

Axcelis 200 ACU, Lam Research SEZ SP 323, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
SEZ SP 323Lam Research
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research SEZ SP 323
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]SEZ (Lam Research)[6]
Model200 ACU[1]—
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Equipment Type—Single wafer wet chemical processor (spin etcher)[5]
Wafer Size—300 mm (12 inch)[5]
Number of Chambers—2[5]
Number of Chemical Handling Cabinets (CHC)—3[5]
Number of Load Ports—4 (FOUP type)[5]
Year of Manufacture (documented unit)—2005[5]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]ptwsingapore.comptwsingapore.com
  6. [6]Equipment inventory listing