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Comparison ledger

200 ACUversus2300 Versys Kiyo Polysilicon

Axcelis 200 ACU, Lam Research 2300 Versys Kiyo Polysilicon, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Lam Research 2300 Versys Kiyo Polysilicon
Cited variants—
Specifications
ConfigurationParts Machine[2]—
ManufacturerAxcelis[2]—
Model200 ACU[2]—
Tool typeAsher[2]—
Wafer size200mm[4]—
Serial numberAU6A356AH[4]—
Computer systemM 200 PC, M 200[5]—
Part numberSC 4572 A[5]—
Volts208[5]—
Amps30[5]—
Equipment typeAsher[2]—
Wafer configuration8 inch[3]—
Wafer Size—300mm (12 inch)[6]
Application—Polysilicon Etch[7]
Configuration (Kiyo 2300 V2)—4 Kiyo CX chambers, 3 load ports, ATM robot with one end effector, VTM robot with dual end effectors, software version SP15-HF6, communication protocols RS232 and LON[1]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]media-moov-co.s3.us-west-1.amazonaws.commedia-moov-co.s3.us-west-1.amazonaws.com
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]Equipment inventory listing
  7. [7]fabsurplus.comfabsurplus.com