Waferpedia

Comparison ledger

Eagle Express GoCuversus10100

ASM Eagle Express GoCu, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
OEMASMWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM EagleWest Bond 10100
Specifications
Configuration50/60 Hz[1]—
Voltage110 VAC[1]—
Phase1 Phase[2]—
Equipment typeWire bonder[1]—
MakeASM[1]—
ModelEagle Express GoCu[1]—
Vintage2014[1]—
Power50/60 Hz, 110 VAC[1]—

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]cmtec.chcmtec.ch