Waferpedia

Comparison ledger

xR Leap Ionversus200 PCU

Applied Materials xR Leap Ion, Axcelis 200 PCU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
xR Leap IonApplied Materials
200 PCUAxcelis
OEMApplied MaterialsAxcelis
CategoryIon ImplantationIon Implantation
Wafer sizeSi Wafer—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2000 Vintage
Control system——
Generation——
FamilyApplied Materials xR Leap IonAxcelis NV GSD 200
Cited variants—
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
Specifications
Voltage205 Vac[3]400 V[4]
Frequency60 Hz, 3 Phase, 5 Wire[3]50 Hz[4]
Wafer sizeSi Wafer[3]—
Gases usedN2, Argon, BF3-cylinder, AsH3(SDS), PH3 (SDS), GeF4-cylinder- All inside an internal gas box[3]—
Wafer Size8 inch[3]—
Power Requirements205 Vac, 60 Hz, 3 Phase, 5 Wire[3]—
Wafer Wheel Capacity17 wafer[3]—
Energy RangeUltra low energy range (300 eV)[3]—
Number of Vaporizer Sources2[3]—
Plasma Flood GunYes[3]—
Gases UsedN2, Argon, BF3 (cylinder), AsH3 (SDS), PH3 (SDS), GeF4 (cylinder)[3]—
Gas BoxInternal gas box[3]—
Automation SoftwareAdvanced Automation Software[3]—
Spare Parts IncludedYes[3]—
Substrate MaterialSi Wafer[3]—
P/N—SC 4840 A[4]
Phase—3 Phase[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]inventory listing