Comparison ledger
Applied Materials Vantage Radiance Plus RTP, Heller 1088, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Vantage Radiance Plus RTPApplied Materials | 1088Heller |
|---|---|---|
| OEM | Applied Materials | Heller |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | (2) 25-wafer ADOE FOUP Load ports | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Vantage Radiance | Heller 1088 |
| Specifications | ||
| Configuration | 2 chambers[1] | — |
| Factory Interface | 5.3[2] | — |
| Wafer size | (2) 25-wafer ADOE FOUP Load ports[3] | — |
| Chambers | 2[1] | — |
| Wafer handling | (2) 25-wafer ADOE FOUP Load ports[2] | — |
| Version | 300 mm[4] | — |
| Vintage | 01.06.2010[5] | — |
| Heating Zones | — | 8 zones (4 top and 4 below) plus 1 cooling zone[6] |
| Heating Method | — | Forced convection[6] |
| Conveyor Width | — | 18 inches (45 cm)[6] |
| Heated Length | — | 43.5 inches (111 cm)[6] |
| Overall Length | — | 96 inches (244 cm)[6] |
| Height | — | 50 inches (127 cm)[6] |
| Net Weight | — | 900 lbs (409 kg)[6] |
| Thermal Profiler | — | Included[6] |
| Oven Top | — | Counter balance for easy access to conveyor[6] |
| Solder Compatibility | — | Lead-free and leaded soldering[6] |
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