Waferpedia

Comparison ledger

Producer SEversusConcept One 200

Applied Materials Producer SE, Lam Research Concept One 200, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Deposition, null[1]
Side-by-side comparison of selected equipment models
Attribute
Producer SEApplied Materials
Concept One 200Lam Research
OEMApplied MaterialsLam Research
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2006 Vintage · 2008 Vintage—
Control system——
Generation——
FamilyApplied Materials ProducerLam Research Concept One 200
Cited variants—
  • Concept One 200 CVD[1]
  • Concept One 200 PECVD[2]
Specifications
ConfigurationChambers:[3]TEOS[2]
Phase3 Phase[6]—
Wafer Size12 inch (300mm)[3]200 mm (8 inch)[8]
Process TypePECVD (Plasma-Enhanced Chemical Vapor Deposition)[3]—
Chamber Configuration (PECVD)A: PECVD APE, B: PECVD TEOS, C: PECVD BLOK[3]—
Chamber Configuration (CVD)ACL (2CH) – two chambers[4]—
Electrical Requirements3 Phase, 4 Wire, 50/60 Hz[6]—
Vintage Year2006[4]—
Process typeCVD[4]—
Process type variantPECVD[3]—
Chamber configurationChamber A: PECVD APE; Chamber B: PECVD TEOS; Chamber C: PECVD BLOK[3]—
Vintage2006, 2007, 2008[4]—
Chamber types (PECVD)APE, TEOS, BLOK[3]—
Manufacturing vintage2006/2007[4]—
Electrical3 phase, 4 wire, 50/60 Hz[6]—
OEMApplied Materials[3]—
ModelProducer SE[3]—
Wafer size12 inch[7]—

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Sources (8)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]Equipment inventory listing
  8. [8]Equipment inventory listing