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Comparison ledger

PI 9500 Ionversus160 XP

Applied Materials PI 9500 Ion, Varian 160 XP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
PI 9500 IonApplied Materials
160 XPVarian
OEMApplied MaterialsVarian
CategoryIon ImplantationIon Implantation
Wafer sizeWafer Loader Blade Control PCB—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials PI 9500Varian 160 XP
Cited variants—
Specifications
ConfigurationBelt Drive[2]—
Frequency60 Hz[2]—
UtilitiesTop feed[2]—
Water fittingsImperial[2]—
Remote distance6m umbilical[2]—
LayoutThru wall[2]—
Wafer cassette26 wafers[2]—
Helium line length15 m[2]—
Factory interfaceSECS / GEM[2]—
Tilt angleVariable 0-7 degree[2]—
Plasma Flood SystemHDPFS[2]—
BeamlineStandard[2]—
Source typeBernas[2]—
Front plateTungsten[2]—
Extraction typeSingle bellows[2]—
MakeApplied Materials[2]—
ModelPI 9500[2]—
Equipment typeIon Implanter[2]—
Wafer Sizes6 inch[2]—
DriveBelt Drive[2]—
PumpsLeybold Turbo pumps; Ebara A07V Mech pump; CTI Cryo pump[2]—
Standard wheel25 wfr wheel[2]—
Source chamber linersIncluded[2]—
MRS Chamber LinersIncluded[2]—
Gas position 1Boron (gas module missing)[2]—
Gas position 2n/a (gas module missing)[2]—
Gas position 3Phosphine[2]—
Gas position 4Arsine[2]—
Wafer sizeWafer Loader Blade Control PCB[2]—
Configuration (160 XP Ion variant)—150mm High Current IMP[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing