Waferpedia

Comparison ledger

Centura IIversus200 ACU

Applied Materials Centura II, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura IIApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials CenturaAxcelis NV GSD 200
Cited variants—
Specifications
ConfigurationDPS + Metal[2]Parts Machine[4]
OEMApplied Materials[1]—
ModelCentura II[1]200 ACU[4]
CategoryEtch[1]—
Wafer sizes6 inch[2]—
Configuration / optionsDPS + Metal[1]—
ChamberDPS II / DPS / Super E / eMxP+ / MxP+ / MxP / eMAX[3]—
ApplicationPoly / Metal / Oxide etch[3]—
Wafer size6 inch[2]200mm[6]
Chamber optionsDPS II, DPS, Super E, eMxP+, MxP+, MxP, eMAX[1]—
Manufacturer—Axcelis[4]
Tool type—Asher[4]
Serial number—AU6A356AH[6]
Computer system—M 200 PC, M 200[7]
Part number—SC 4572 A[7]
Volts—208[7]
Amps—30[7]
Equipment type—Asher[4]
Wafer configuration—8 inch[5]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (7)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]inventory listing
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]wotol.comwotol.com
  7. [7]semistarcorp.comsemistarcorp.com