Comparison ledger
Applied Materials Centura AP eMax CT+, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Centura AP eMax CT+Applied Materials | 200 ACUAxcelis |
|---|---|---|
| OEM | Applied Materials | Axcelis |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Centura AP eMax CT+ | Axcelis NV GSD 200 |
| Specifications | ||
| Wafer size | 300 mm[1] | 200mm[6] |
| Chamber configuration | 3 chambers[1] | — |
| Vintage year | 2007[2] | — |
| Process type | Oxide etch[1] | — |
| Manufacturer | Applied Materials[3] | Axcelis[4] |
| Model | Centura AP eMax CT+[3] | 200 ACU[4] |
| Tool type | Etcher[3] | Asher[4] |
| Application | Semiconductor manufacturing[2] | — |
| Vintage | 01.06.2007[1] | — |
| Configuration | — | Parts Machine[4] |
| Serial number | — | AU6A356AH[6] |
| Computer system | — | M 200 PC, M 200[7] |
| Part number | — | SC 4572 A[7] |
| Volts | — | 208[7] |
| Amps | — | 30[7] |
| Equipment type | — | Asher[4] |
| Wafer configuration | — | 8 inch[5] |
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