Waferpedia

Comparison ledger

Centura AP DPS AdvantEdge G 2 Metalversus200 ACU

Applied Materials Centura AP DPS AdvantEdge G 2 Metal, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura AP DPS AdvantEdge G 2 MetalAxcelis NV GSD 200
Cited variants
  • Centura AP DPS AdvantEdge G2 Poly[1]
—
Specifications
Wafer Size12 inch (300 mm)[2]—
PlatformCentura[2]—
TechnologyDPS[2]—
Process TypeMetal Etch[2]—
Configuration—Parts Machine[3]
Manufacturer—Axcelis[3]
Model—200 ACU[3]
Tool type—Asher[3]
Wafer size—200mm[5]
Serial number—AU6A356AH[5]
Computer system—M 200 PC, M 200[6]
Part number—SC 4572 A[6]
Volts—208[6]
Amps—30[6]
Equipment type—Asher[3]
Wafer configuration—8 inch[4]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]asseta.comasseta.com
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com