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Comparison ledger

Centura AP AdvantEdge G 5 Dryversus1512e

Applied Materials Centura AP AdvantEdge G 5 Dry, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
OEMApplied MaterialsTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials CenturaTegal 1512e
Specifications
Phase3 Phase[1]—
Configuration3 Wire + G Line[1]—
Chamber A Chemicals Gases UsedBCl3, Cl2, SO2, NF3, CH2F2, HBr, O2, N2, CF4, He, CHF3, SF6, Ar[1]—
Chamber B Chemicals Gases UsedBCl3, Cl2, SO2, NF3, CH2F2, HBr, O2, N2, CF4, He, CHF3, SF6, Ar[1]—
Chamber D Chemicals Gases UsedN2, O2, CF4[1]—
OEMApplied Materials[1]—
ModelCentura AP AdvantEdge G 5[1]—
Equipment typeDry Etcher[1]—
Electrical3 Phase - 3 Wire[1]—
LineG Line[1]—
Frequency50/60 Hz[1]—
LoadportStandard Loadport[1]—
Control systemServer GEM II[1]—
Chamber A gasesBCl3, Cl2, SO2, NF3, CH2F2, HBr, O2, N2, CF4, He, CHF3, SF6, Ar[1]—
Chamber B gasesBCl3, Cl2, SO2, NF3, CH2F2, HBr, O2, N2, CF4, He, CHF3, SF6, Ar[1]—
Chamber D gasesN2, O2, CF4[1]—
HDDNo HDD[1]—
Vintage2013[1]—
Tool type—Industrial RIE plasma etcher system[2]
Stated configuration—With modules assembly for CI-4222[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com