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Comparison ledger

9500 XRversus160 XP Ion

Applied Materials 9500 XR, Varian 160 XP Ion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
9500 XRApplied Materials
OEMApplied MaterialsVarian
CategoryIon ImplantationIon Implantation
Wafer sizeWafer on Gripper Sensor—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials PI 9500Varian 160 XP Ion
Specifications
Voltage208 V[1]—
Phase3 phase + Neurtal[1]—
Configuration50/60 Hz[1]150mm High Current IMP[3]
Circuit Breaker250 A[1]—
Interrupt Capacity65000 A[1]—
CPU162 031[1]—
Software4.09[1]—
ChamberCT 10 Cryos[1]—
Source TurboSTP 1000 C[1]—
Mrs TurboSTP 400[1]—
Source BackingQDP 40[1]—
Wafer LoaderQDP 80[1]—
Wafer sizeWafer on Gripper Sensor[1]—
WheelDirect Drive[1]—
Tilt0 to 7[1]—
BF3SDS[1]—
ManufacturerApplied Materials[1]—
Model9500 XR[1]—
CategoryIon Implantation[2]—
Wafer size / configurationWafer on Gripper Sensor[2]—
Frequency50/60 Hz[1]—
OrientFlat Not Found Sensor[1]—
GripperWafer on Gripper Sensor[1]—
Gas BoxBF3, PH3, AsH3[1]—
Source TypeIHC Enlarged Chamber[1]—
Oven CapabilitiesYes, No ovens fitted to source[1]—
Source Magnet5A[1]—
Dual ExtractionBellows, 60 kV, 160 kV max[1]—
Post AcellTotal Energy: 200 kV Max[1]—
Plasma Flood GunStandard[1]—
PH3SDS[1]—
AsH3SDS[1]—

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com