Waferpedia

Comparison ledger

0720 06060 PartversusWL-210

Applied Materials 0720 06060 Part, Signatone WL-210, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0720 06060 PartApplied Materials
WL-210Signatone
OEMApplied MaterialsSignatone
CategoryTest & ProbeTest & Probe
Wafer size—up to 8-inch wafers
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0720 06060 PartSignatone WL-210
Cited variants—
Specifications
ConfigurationContact Pin 24-20 Awg Crimp Gold Flash[2]—
Base—Massive 2" one-piece machined aircraft aluminum base for stability[1]
Platen—Large heavy-duty nickel steel platen with 4 point planar lift[1]
Positioning stage—Fast, accurate and repeatable compound X-Y stage for sub-micron positioning[1]
Wafer/substrate compatibility—Accepts shards through 8" wafers, substrates, PCB's, and ultra-thin wafers[1]
Platen control—Independent platen height (locking) and contact / separate control[1]
Chuck and stage assembly—Non-ferrous chuck and stage assembly reduces magnetic interference and crosstalk[1]
Micropositioner support—Supports bolt-down, vacuum, and magnetic base micropositioners[1]
Chuck biasing—Banana / BNC / Triax chuck biasing[1]
Probe card holder—Quick-Change probe card holder option with independent theta adjust[1]
Microscope—Tilt-back microscope provides unobstructed fixturing access[1]

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing