Comparison ledger
Applied Materials 0720 06060 Part, Electroglas 4090 Automatic Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0720 06060 PartApplied Materials | 4090 Automatic WaferElectroglas |
|---|---|---|
| OEM | Applied Materials | Electroglas |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0720 06060 Part | Electroglas 4090 Automatic Wafer |
| Cited variants | — | |
| Specifications | ||
| Configuration | Contact Pin 24-20 Awg Crimp Gold Flash[2] | — |
| Manufacturer | — | Electroglas[3] |
| Model | — | 4090[3] |
| Equipment type | — | Automatic Wafer Prober[3] |
| Wafer size support | — | 150 mm (6-inch) and 200 mm (8-inch) wafers[4] |
| Input voltage | — | 115VAC[4] |
| Alignment accuracy | — | Micron-level[4] |
| Cassette loader | — | Yes[4] |
| Display control module | — | DCM II or DCM-2[4] |
| Material handler module station | — | CONT (ESC) or MHCM[4] |
| Prober control module | — | Yes[4] |
| Vision module | — | PRM-3[4] |
| Chuck | — | 8 inch hot gold[5] |
| Options | — | OCR, cleaning pad[5] |
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