Waferpedia

Comparison ledger

0041-39086 ESC PartversusApollo

Applied Materials 0041-39086 ESC Part, Trion Apollo, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
ApolloTrion
OEMApplied MaterialsTrion
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Trion Apollo
Specifications
Wafer size—100mm to 300mm[1]
Etch rate (photoresist strip)—up to 6 µm/min[1]
Plasma source options—Inductively Coupled Plasma (ICP) or SST-Lightning microwave[2]
RF bias—Yes (RIE biased electrode)[3]
Tuning—Self-tuning / automatic tuning[1]
Chuck type—Electrostatic chuck with helium backside cooling[3]
Wafer handling robot—Multi-axis atmospheric robot; transports 150mm, 200mm, and 300mm wafers[3]
Process controller—PC-based with graphical software; recipes stored on 3.5" disks[3]
Physical dimensions (W x D x H)—18" x 50" x 51"[3]
Maximum wafer size (stated in source)—up to 8" (200mm) — note: source also states robot handles 300mm wafers[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]triontech.comtriontech.com
  2. [2]triontech.comtriontech.com
  3. [3]semiconductoronline.comsemiconductoronline.com