Waferpedia

Comparison ledger

0041-26723 Bonded Assemblyversus7700B

Applied Materials 0041-26723 Bonded Assembly, West Bond 7700B, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
7700BWest Bond
OEMApplied MaterialsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyWest Bond 7700B
Specifications
Type—ball bonder[1]
Described as—gold ball wire bonder w/ heated workholder & controller[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com