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0041-26723 Bonded Assemblyversus747677E

Applied Materials 0041-26723 Bonded Assembly, West Bond 747677E, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
747677EWest Bond
OEMApplied MaterialsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyWest Bond 747677E
Specifications
OEM—West Bond[1]
Model—747677E[1]
Location—Sample Prep Room[1]
Primary training contact—Talmage Tyler[1]
Bond force range—10-250 grams[1]
Ultrasonics—built-in, 4 watts[1]
Wire size—1 mil (25.4 um)[1]
Ball bond size—~ 85 um[1]
Equipment type—Wire bonder[2]
Primary bonding material—Gold wire[1]
Bonding configuration—Ball bonding[1]
Convertible bonding methods—Wedge and ball bonding[3]
Compatible wire materials—Al and Au wires[3]
Compatible wire diameter range—0.7 mil to 2 mil[3]
Ultrasonic transducer—4 W, 63 kHz[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]smif.pratt.duke.edusmif.pratt.duke.edu
  2. [2]smif.pratt.duke.edusmif.pratt.duke.edu
  3. [3]uwaterloo.cauwaterloo.ca